Show simple item record

dc.contributor.authorGutiérrez M.F.
dc.contributor.authorBermudez J.
dc.contributor.authorDávila-Sánchez A.
dc.contributor.authorAlegría-Acevedo L.F.
dc.contributor.authorMéndez-Bauer L.
dc.contributor.authorHernández M.
dc.contributor.authorAstorga J.
dc.contributor.authorReis A.
dc.contributor.authorLoguercio A.D.
dc.contributor.authorFarago P.V.
dc.contributor.authorFernández E.
dc.date.accessioned2020-09-02T22:19:54Z
dc.date.available2020-09-02T22:19:54Z
dc.date.issued2019
dc.identifier10.1016/j.jmbbm.2019.07.024
dc.identifier.citation100, , -
dc.identifier.issn17516161
dc.identifier.urihttps://hdl.handle.net/20.500.12728/4804
dc.descriptionThis study evaluated the MMP inhibition of the zinc oxide and copper nanoparticles (ZnO/CuNp), and the effects of their addition into adhesives on antimicrobial activity (AMA), ultimate tensile strength (UTS), in vitro degree of conversion (in vitro-DC), as well as, resin–dentin bond strength (μTBS), nanoleakage (NL) and in situ-DC on caries-affected dentin. Anti-MMP activity was evaluated for several MMPs. ZnO/CuNp (0% [control]; 5/0.1 and 5/0.2 wt%) were added into Prime&Bond Active (PBA) and Ambar Universal (AMB). The AMA was evaluated against Streptococcus mutans. UTS were tested after 24 h and 28d. After induced caries, adhesives and composite were applied to flat dentin surfaces, and specimens were sectioned to obtain resin–dentin sticks. μTBS, NL, in vitro-DC and in situ-DC were evaluated after 24 h. ANOVA and Tukey's test were applied (α = 0.05). ZnO/CuNp demonstrated anti-MMP activity (p < 0.05). The addition of ZnO/CuNp increased AMA and UTS (AMB; p < 0.05). UTS for PBA, in vitro-DC, in situ-DC and μTBS for both adhesives were maintained with ZnO/CuNp (p > 0.05). However, lower NL was observed for ZnO/CuNp groups (p < 0.05). The addition of ZnO/CuNp in adhesives may be an alternative to provide antimicrobial, anti-MMP activities and improves the integrity of the hybrid layer on caries-affected dentin. © 2019 Elsevier Ltd
dc.language.isoen
dc.publisherElsevier Ltd
dc.subjectCopper
dc.subjectMicrotensile bond strength
dc.subjectNanoleakage
dc.subjectNanoparticles
dc.subjectUniversal adhesive system
dc.subjectZinc oxide
dc.subjectBond strength (materials)
dc.subjectCopper
dc.subjectII-VI semiconductors
dc.subjectMetal nanoparticles
dc.subjectMicroorganisms
dc.subjectNanoparticles
dc.subjectResins
dc.subjectTensile strength
dc.subjectZinc oxide
dc.subjectAnti-microbial activity
dc.subjectDegree of conversion
dc.subjectInterface stabilities
dc.subjectMicro-tensile bond strength
dc.subjectNanoleakages
dc.subjectStreptococcus mutans
dc.subjectUltimate tensile strength
dc.subjectUniversal adhesives
dc.subjectAdhesives
dc.subjectadhesive agent
dc.subjectcopper nanoparticle
dc.subjectzinc oxide nanoparticle
dc.subjectadult
dc.subjectantimicrobial activity
dc.subjectArticle
dc.subjectconfocal laser scanning microscopy
dc.subjectcontrolled study
dc.subjectdental caries
dc.subjectdentin
dc.subjecthuman
dc.subjectin vitro study
dc.subjectpriority journal
dc.subjectStreptococcus mutans
dc.subjecttensile strength
dc.titleZinc oxide and copper nanoparticles addition in universal adhesive systems improve interface stability on caries-affected dentin
dc.typeArticle


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record