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Biological, mechanical and adhesive properties of universal adhesives containing zinc and copper nanoparticles

dc.contributor.authorGutiérrez M.F.
dc.contributor.authorAlegría-Acevedo L.F.
dc.contributor.authorMéndez-Bauer L.
dc.contributor.authorBermudez J.
dc.contributor.authorDávila-Sánchez A.
dc.contributor.authorBuvinic S.
dc.contributor.authorHernández-Moya N.
dc.contributor.authorReis A.
dc.contributor.authorLoguercio A.D.
dc.contributor.authorFarago P.V.
dc.contributor.authorMartin J.
dc.contributor.authorFernández E.
dc.date.accessioned2020-09-02T22:19:53Z
dc.date.available2020-09-02T22:19:53Z
dc.date.issued2019
dc.identifier10.1016/j.jdent.2019.01.012
dc.identifier.citation82, , 45-55
dc.identifier.issn03005712
dc.identifier.urihttps://hdl.handle.net/20.500.12728/4793
dc.descriptionObjectives: To evaluate the effect of addition of zinc oxide and copper nanoparticles (ZnO/CuNp) into universal adhesives, on antimicrobial activity (AMA), cytotoxicity (CTX), water sorption (WS) and solubility (SO), microhardness (MH) and in vitro degree of conversion (DC), as well as resin-dentin microtensile bond strength (μTBS), nanoleakage (NL) and in situ DC. Methods: ZnO/CuNp (0% [control]; 5/0.1 and 5/0.2 wt%) were added in Prime&Bond Active (PBA) and Ambar Universal (AMB). The AMA was evaluated against Streptococcus mutans. For CTX, Saos-2 cell-line was used. For WS and SO, specimens were tested for 28d. For MH, specimens were tested after 24 h and 28d and for in vitro DC, specimens were evaluated after 24 h. After, the adhesives were applied to flat dentine surfaces, composite resin build-ups, specimens were sectioned to obtain resin–dentine sticks. It was evaluated in μTBS, NL and in situ DC after 24 h of water storage. ANOVA and Tukey's test were applied (α = 0.05). Results: The addition of 5/0.2 ZnO/CuNp increase AMA and WS, but decrease the SO when compared to control (p < 0.05). The CTX and μTBS were maintaining with adhesive-containing ZnO/CuNp (p > 0.05). MH, in vitro DC and in situ DC was significant increase (AMB) or maintaining (PBA) with ZnO/CuNp addition. However, significantly lower NL was observed for ZnO/CuNp groups (p < 0.05). Conclusions: The addition of ZnO/CuNp in the tested concentrations in universal adhesive systems may be an alternative to provide antimicrobial activity and improves the integrity of the hybrid layer, without jeopardizing biological, adhesives and mechanical properties. Significance: This is the first study that demonstrates that the addition of zinc oxide and copper nanoparticles in concentrations up to 5/0.2 wt% in two universal adhesive systems is a feasible approach and may be an alternative to adhesive interfaces with antimicrobial properties and less defects in the resin-dentin interface. © 2019 Elsevier Ltd
dc.language.isoen
dc.publisherElsevier Ltd
dc.subjectCopper
dc.subjectMicrotensile bond strength and nanoleakage
dc.subjectNanoparticles
dc.subjectUniversal adhesive system
dc.subjectZinc oxide
dc.subjectcopper
dc.subjectdentin bonding agent
dc.subjectnanoparticle
dc.subjectresin cement
dc.subjecttooth cement
dc.subjectzinc
dc.subjectchemistry
dc.subjectdental bonding
dc.subjectdentin
dc.subjecthuman
dc.subjectmaterials testing
dc.subjectmetabolism
dc.subjecttensile strength
dc.subjecttooth disease
dc.subjectCopper
dc.subjectDental Bonding
dc.subjectDental Cements
dc.subjectDental Leakage
dc.subjectDentin
dc.subjectDentin-Bonding Agents
dc.subjectHumans
dc.subjectMaterials Testing
dc.subjectNanoparticles
dc.subjectResin Cements
dc.subjectTensile Strength
dc.subjectZinc
dc.titleBiological, mechanical and adhesive properties of universal adhesives containing zinc and copper nanoparticles
dc.typeArticle


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